Parylene N Dimer, [2.2] Paracyclophane is an organically synthesized polymeric nano material

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Parylene N Dimer, [2.2] Paracyclophane is an organically synthesized polymeric nano material

2503

March 21, 2025

Category Connection: Rubber Coating Material

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#coating additives #polyester resin raw materials #Stabilizer Raw Material

Parylene high-performance thin-film coating widely used in electronics medical devices aerospace excellent electrical insulation chemical resistance and superior physical protective properties
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BIPB CAS 2212-81-9 1,3-bis(tert-Butylperoxy-isopropyl)benzene Environment Friendly Crosslinking Agent, Curing Agent And Vulcanizing Agent For CPE, EPDM, EVA, PE, Silicone Rubber, NBR And Fluorubber
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Hydroxyl alkyl amide N,N,N',N'-Tetrakis(2-hydroxyethyl)adipamide is a tetrafunctional compound that exhibits excellent mechanical properties and weather resistance use for powder coatings.
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Tris(oxiranylmethyl) benzene-1,3,5-tricarboxylate is a trifunctional glycidyl ester compound that functions as a high-performance curing agent for epoxy and polyester resin systems in powder coatings
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Anti-hydrolysis agent Plastic Additive N,N'-Bis(2.6-diisopropylphenyl)carbodiimide is a monomer carbodiimide for polyester polyurethanes(PU and TPU) and biodegradable resins like PLA PBAT PPC PHAs.
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Parylene C Dimer Chlorinated modified parylene monomer Stronger chemical stability and barrier

2503

March 21, 2025

00:19

2,2-Bis(hydroxymethyl)butyric acid Good solubility,Environment-friendly Crossling hydrophilic agent

2503

March 20, 2025

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Electronic level Colorless polyimide monomers

2310

October 19, 2023

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Spiro-OMeTAD is one of the most studied and suitable HTL materials

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October 19, 2023

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Calcium Sodium PVM MA Copolymer CAS 62386-95-2 For Denture Adhesive

Personal Care Raw Materials

June 12, 2025

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MDEA is used as polyurethane chain extender and epoxy curing agent

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March 18, 2025

00:11

TiOPc Used for Charge Generation Layer (CGL) in Organic Photo-Conductor (OPC) drum

Packaging details

March 20, 2025

00:22

MCDEA is an aromatic chain extender. It has good compatibility with TDI-based prepolymer

2310

March 18, 2025

00:18

Excellent high-temperature resistance material N,N-4,4-diphenylmethyenebismaleimide(Bismaleimide,BMI

2503

March 20, 2025

00:24

High Purity 99.0% Min.Trimethylene Carbonate TMC used for Absorbable Polymer

2503

March 19, 2025

Parylene N Dimer, [2.2] Paracyclophane is an organically synthesized polymeric nano material

Parylene high-performance thin-film coating widely used in electronics medical devices aerospace excellent electrical insulation chemical resistance and superior physical protective properties

BIPB CAS 2212-81-9 1,3-bis(tert-Butylperoxy-isopropyl)benzene Environment Friendly Crosslinking Agent, Curing Agent And Vulcanizing Agent For CPE, EPDM, EVA, PE, Silicone Rubber, NBR And Fluorubber

Hydroxyl alkyl amide N,N,N',N'-Tetrakis(2-hydroxyethyl)adipamide is a tetrafunctional compound that exhibits excellent mechanical properties and weather resistance use for powder coatings.

Tris(oxiranylmethyl) benzene-1,3,5-tricarboxylate is a trifunctional glycidyl ester compound that functions as a high-performance curing agent for epoxy and polyester resin systems in powder coatings

Anti-hydrolysis agent Plastic Additive N,N'-Bis(2.6-diisopropylphenyl)carbodiimide is a monomer carbodiimide for polyester polyurethanes(PU and TPU) and biodegradable resins like PLA PBAT PPC PHAs.

Parylene C Dimer Chlorinated modified parylene monomer Stronger chemical stability and barrier

2,2-Bis(hydroxymethyl)butyric acid Good solubility,Environment-friendly Crossling hydrophilic agent

Electronic level Colorless polyimide monomers

Spiro-OMeTAD is one of the most studied and suitable HTL materials

Calcium Sodium PVM MA Copolymer CAS 62386-95-2 For Denture Adhesive

MDEA is used as polyurethane chain extender and epoxy curing agent

TiOPc Used for Charge Generation Layer (CGL) in Organic Photo-Conductor (OPC) drum

MCDEA is an aromatic chain extender. It has good compatibility with TDI-based prepolymer

Excellent high-temperature resistance material N,N-4,4-diphenylmethyenebismaleimide(Bismaleimide,BMI

High Purity 99.0% Min.Trimethylene Carbonate TMC used for Absorbable Polymer